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LTC3490
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ± 0.05
R = 0.115
TYP
5
8
0.38 ± 0.10
3.5 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
3.00 ± 0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
(DD8) DFN 1203
0.25 ± 0.05
0.50
0.200 REF
0.75 ± 0.05
4
0.25 ± 0.05
1
0.50 BSC
BSC
2.38 ± 0.10
2.38 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.189 – .197
.050 BSC
.045 ± .005
(4.801 – 5.004)
NOTE 3
8
7
6
5
.245
MIN
.160 ± .005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ± .005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
3
4
.010 – .020
(0.254 – 0.508)
.008 – .010
(0.203 – 0.254)
× 45 °
0 ° – 8 ° TYP
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
NOTE:
1. DIMENSIONS IN
.016 – .050
(0.406 – 1.270)
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
.050
(1.270)
BSC
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
SO8 0303
3490fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
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